Precision Processing Components

Wedge Bonding

Wedge Bonding

Zirconia Wedges are used for Wedge Bonding Processes. A Bonding Wire is pressed on the pad by using a Bonding Wedge. On the pressing wire, ultrasonic energy is given to the wedge head. The pressure and friction which is caused by the ultrasonic vibration is transduced to heat and the wire is bonded onto the pad.

Compared with conventional products, Zirconia Wedges have little adhesion to dust. Zirconia Wedges have a longer life span and have excellent bonding characteristics.

Besides a square pillar form and a pillar form, custom configurations of the tip of the wedge can also be accommodated.